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º» º¸°í¼´Â LED BLUÀÇ ÇÙ½ÉƯÇã ¹× ¿øõ±â¼úÀ» º¸À¯ÇÏ°í Àִ ȸ»ç, Substrate / EPI / Chip / Package ±â¼úÀ» ±â¹ÝÀ¸·Î Çϴ ȸ»ç, LED BLU ºÎºÐÀÇ Assembly / Array / Driver ±â¼úÀ» °³¹ßÇÏ°í Àִ ȸ»ç µî ±¹³»¿Ü ÁÖ¿ä ȸ»çµéÀÇ 1986³â 1¿ù 1ÀϺÎÅÍ 2007³â 6¿ù±îÁö ¹Ì±¹ ¹× Çѱ¹¿¡ ±Ç¸®ÈµÇ¾î ÀÖ´Â µî·ÏƯÇãÀÇ ºÐ¼®À» ÅëÇØ LED BLU °ü·Ã ƯÇã ±â¼úÀÇ µ¿ÇâÀ» ºÐ¼®ÇÏ¿´´Ù.
Patent Application of 10 Companies in Korea
Ãâó: LED BLU ÇÙ½ÉƯÇ㠺м®, Oct. 2007 µð½ºÇ÷¹À̹ðÅ©
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µð½ºÇ÷¹À̹ðÅ©´Â À̹ø¿¡ ¹ß°£µÈ LED BLU ÇÙ½ÉƯÇ㠺м®À» ÅëÇØ LED BLU ¿¬±¸°³¹ß ¹æÇâ ¼ö¸³°ú ÇâÈÄ ¹ß»ýÇÒ ¼ö Àִ ƯÇã ºÐÀï ´ëÀÀ¿¡ Àû±Ø È°¿ëµÇ¾îÁö±â¸¦ Èñ¸ÁÇÑ´Ù.
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I. °³¿ä 1. Technology Introduction 1.1 Technology Introduction 1.1.1 Outline 1.1.2 Technical development trend 1.1.3 Market Prospects 1.2 LED BLU 1.2.1 Structure of LED BLU 1.2.2 Manufacturing process of LED 1.2.3 Emitting Light Type of LED BLU 1.2.4 LED Array 1.2.5 Heat radiating of LED BLU 1.2.6 Driver of LED BLU 1.3 Major companies in LED BLU Technology 2. Analysis criteria and Analysis scope 2.1 Analysis Criteria 2.1.1 Used Database and reference period 2.1.2 Technical Classification of LED BLU 2.2 Analysis scope 2.2.1 Outline 2.2.2 First Search Query (by main keyword) 2.2.3 Second Search Query (by main keyword and assignies) 2.3 Final available data
II. ƯÇã µ¿Ç⠺м® 1. Overall Patent Activities 1.1 Patent Application of Top 10 Assignee 1.2 IPC(International Patent Classification) Trend 1.3 Patent Application of 10 Companies in US 1.4 Patent Application of 10 Companies in Korea 1.5 Patent Application of 10 Companies in Japan 1.6 Patent Application of 10 Companies in Europe 2. Patent Analysis in US Application 2.1 Application Activities by Year 2.2 Application Activities by Country 2.3 Application Activities by Technology 2.4 Portfolio Analysis by Patent Share and Increase 2.5 Application Activities by Assignee 2.5.1 Application of US Assignee 2.5.2 Application of Korea Assignee 2.5.3 Application of Japan Assignee 2.5.4 Application of Taiwan Assignee 2.6 Application Activities by Top 10 Assignee 2.6.1 Overall Status of Top 10 Assignee 2.6.2 Detailed Status of the Assignee
III. ½ÉÃþ ºÐ¼® 1. In-Depth Analysis of Major Assignee 1.1 NICHIA¡¯S Patent Analysis 1.1.1 NICHIA¡¯S US Patents 1.1.2 NICHIA¡¯S US Patents by Technology 1.1.3 NICHIA¡¯S Competitor Analysis by Citation Relations 1.1.4 NICHIA¡¯S Patent List by Technology 1.1.5 NICHIA¡¯S Technology Trend 1.1.6 A Summary of NICHIA¡¯S Key Patents 1.2 LUMILEDS¡¯S Patent Analysis 1.2.1 LUMILEDS¡¯S US Patents 1.2.2 LUMILEDS¡¯S US Patents by Technology 1.2.3 LUMILEDS¡¯S Competitor Analysis by Citation Relations 1.2.4 LUMILEDS¡¯S Patent List by Technology 1.2.5 LUMILEDS¡¯S Technology Trend 1.2.6 A Summary of LUMILEDS¡¯S Key Patents 1.3 OSRAM¡¯S Patent Analysis 1.3.1 OSRAM¡¯S US Patents 1.3.2 OSRAM¡¯S US Patents by Technology 1.3.3 OSRAM¡¯S Competitor Analysis by Citation Relations 1.3.4 OSRAM¡¯S Patent List by Technology 1.3.5 OSRAM¡¯S Technology Trend 1.3.6 A Summary of OSRAM¡¯S Key Patents 1.4 CREE¡¯S Patent Analysis 1.4.1 CREE¡¯S US Patents 1.4.2 CREE¡¯S US Patents by Technology 1.4.3 CREE¡¯S Competitor Analysis by Citation Relations 1.4.4 CREE¡¯S Patent List by Technology 1.4.5 CREE¡¯S Technology Trend 1.4.6 A Summary of CREE¡¯S Key Patents 1.5 TOYODA GOSEI¡¯S Patent Analysis 1.5.1 TOYODA GOSEI¡¯S US Patents 1.5.2 TOYODA GOSEI¡¯S US Patents by Technology 1.5.3 TOYODA GOSEI¡¯S Competitor Analysis by Citation Relations 1.5.4 TOYODA GOSEI¡¯S Patent List by Technology 1.5.5 TOYODA GOSEI¡¯S Technology Trend 1.5.6 A Summary of TOYODA GOSEI¡¯S Key Patents 2. Detailed Analysis of Others Assignee 2.1 SHARP, CITIZEN, ROHM, Samsung Electro- Mechanics, TOSHIBA 2.1.1 Substrate 2.1.2 Epi 2.1.3 Chip 2.1.4 Package 2.1.5 Assembly 2.1.6 Array 2.1.7 Driver 2.2 Others (HONEYWELL, EPISTAR, Agilent Technologies, etc.)
IV. °á¾ð 1. Technical development prospects 2. Patent strategy
V. INDEX |